A look at advanced chip packaging, now more reliant on TSMC and its partners in Taiwan than ever, and the efforts to address this bottleneck in the US
THE SO WHAT
Advanced packaging has quietly become the new choke point for AI compute—more concentrated in Taiwan around TSMC and its partners than wafer fabrication itself. If you’re betting on custom accelerators or high-bandwidth multi-die designs, you now have to underwrite packaging geography and US capacity timelines, not just node roadmaps.
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