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Deep & Emerging Tech·July 13, 2026·1 min read

A Taiwanese minister says TSMC plans two more advanced chip packaging plants in Chiayi Science Park, with all four expected to generate $9.35B+ in annual output

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TSMC adding two more advanced packaging plants in Chiayi—targeting over $9.35B in annual output across four sites—confirms that packaging, not just wafers, is becoming a core capacity bottleneck for AI hardware. Hardware buyers should treat advanced packaging slots as a constrained resource and press vendors on their long-term access, not just on raw compute specs.