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Deep & Emerging Tech·September 9, 2026·1 min read

Amkor is taking its Arizona chip packaging campus to $12bn

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Advanced packaging is becoming a US-based strategic asset—Amkor’s ~$12B Arizona build-out adds 60,000 m² of cleanroom on top of 33,000 m² already planned, reducing reliance on overseas OSAT capacity. If your roadmap depends on high-bandwidth chiplets or 2.5D/3D stacks, start mapping packaging constraints and domestic options alongside wafer supply.