ASML plans to build EUV machines 30% faster as AI demand outstrips its production capacity
THE SO WHAT
ASML cutting EUV tool cycle times by roughly a third is a reminder that the real AI bottleneck is lithography throughput, not just GPUs. If your strategy assumes ever-falling compute prices, bake in the risk that tool capacity — and thus wafer supply — stays tight even as demand surges.
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