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Deep & Emerging Tech·October 6, 2026·1 min read

ASML’s Chip Technology Move Threatens Besi Shares, BofA Says

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ASML moving into advanced packaging territory that overlaps with Besi is another sign that chip value is migrating from fab to integration. If you’re a systems builder, watch how packaging roadmaps consolidate—your future performance and supply risk may hinge more on who controls 3D stacking than on who prints the wafers.