0
Deep & Emerging Tech·July 25, 2026·1 min read

Samsung signs a $200 billion chip deal with Broadcom covering memory, foundry and advanced packaging through 2030

Share

A $200B, five-year Samsung–Broadcom pact hardens AI chips as a long-cycle, vertically coordinated supply chain, not a spot market. If you're building on AI infra, assume fewer, larger upstream relationships and more pricing power concentrated in those networks.

Deep & Emerging Tech

'The government has all but forgotten that most data centres require water to cool their systems': Industry trade board warns UK government over data center thirst for resources

Tripling UK data center capacity by 2030 without a water plan turns cooling into a permitting and political risk, not just an engineering one. If you’re siting AI infra in water-stressed regions, assume future constraints and price in alternative cooling, reclamation, or relocation now rather than after moratoria hit.

Deep & Emerging Tech

Sources: CXMT expelled Huawei-linked SiCarrier staff from its R&D zone amid a pricing dispute, as Chinese memory makers flex their newfound clout to hike prices

Chinese memory makers using newfound pricing power — to the point of expelling Huawei-linked staff over disputes — signals that DRAM and NAND are no longer buyer’s markets in the AI boom. If your AI infra bill assumes flat or falling memory prices, revisit those models and consider multi-region, multi-vendor hedging now.