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Deep & Emerging Tech·July 30, 2026·1 min read

DOGE Veterans Are Landing Big Jobs at Prediction Markets

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Prediction markets are pulling in meme-coin operators because they know how to manufacture attention and liquidity under regulatory fog. If you’re building in this space, assume the competitive bar is not just product and UX — it’s community ops tuned for scrutiny from day one.

Deep & Emerging Tech

Sources: TSMC is developing advanced AI chip packaging tech, internally called "EMIB-like", similar to Intel's Embedded Multi-die Interconnect Bridge technique

If TSMC brings an EMIB-like bridge in-house, advanced packaging becomes less of a single-vendor differentiator and more of a baseline for AI accelerators. For infra buyers, the medium-term upside is more options on high-bandwidth multi-die designs — but also more complexity in qualifying heterogeneous packages.