Sources: TSMC is developing advanced AI chip packaging tech, internally called "EMIB-like", similar to Intel's Embedded Multi-die Interconnect Bridge technique
THE SO WHAT
If TSMC brings an EMIB-like bridge in-house, advanced packaging becomes less of a single-vendor differentiator and more of a baseline for AI accelerators. For infra buyers, the medium-term upside is more options on high-bandwidth multi-die designs — but also more complexity in qualifying heterogeneous packages.
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