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Deep & Emerging Tech·July 30, 2026·1 min read

Vexlum Opens UK Laboratory and Appoints Dr. Stefan Truppe to Lead Local Operations

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High-power VECSEL expansion into the UK is another brick in Europe’s quantum and photonics supply chain. If you rely on advanced lasers for quantum or sensing, this kind of regional capacity reduces single-country risk and may open up new collaboration or procurement options.

Deep & Emerging Tech

Sources: TSMC is developing advanced AI chip packaging tech, internally called "EMIB-like", similar to Intel's Embedded Multi-die Interconnect Bridge technique

If TSMC brings an EMIB-like bridge in-house, advanced packaging becomes less of a single-vendor differentiator and more of a baseline for AI accelerators. For infra buyers, the medium-term upside is more options on high-bandwidth multi-die designs — but also more complexity in qualifying heterogeneous packages.